Item Tag: 0.29 Pounds
3 posts
Esthepro Integrated Circuits Silicon Wafer Made by Copper Process (8 Inch)
Consider it as thin glassware, handle and display it with care. Keep away to the children. 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer.
July 4, 2026
Integrated Circuits Silicon Wafer Made by Copper Process (8 Inch)
Consider it as thin glassware, handle and display it with care. Keep away to the children. 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer.
July 4, 2026
Integrated Circuits Silicon Wafer Made by Copper Process (8 Inch)
Consider it as thin glassware, handle and display it with care. Keep away to the children. 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer.
July 4, 2026